Sonoscan
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Microelectronics
MEMS
Mil/Aero/Auto
Composites
Materials
Solar Energy
Packaging, Seals (Poly/Foil)
Medical
Home > Market Applications

Market Applications

Sonoscan systems and SonoLab services are appropriate for a wide range of samples and needs, and are your best insurance against latent defects that may escape conventional testing methods.

Applications include:
Microelectronics
• Plastic Encapsulated Microcircuits
• Ceramic Chip Capacitors
• Die Attach
• Chip Scale Packages (CSPs)
• Flip Chips
• Stacked Dies
• Ball Grid Arrays (BGAs/CBGAs)
• Tape Automated Bond (TAB)
• Hybrids, MCMs, SIPs
• Flex Circuits
• Printed Circuit Boards (PCBs)
• Smart Cards
• Bonded Wafers
• Thermo Electric Coolers (TECs)
• Power Modules

Military, Aerospace,
and Automotive

• High-Rel Qualification
• Upscreening COTS
• Qualification
• Lead Free Devices

Microelectromechanical Systems (MEMS)
• Bonded Wafers
• Fabrication Process Evaluation
• Zero Level Packaging
• Seal Integrity Evaluation
• Packaging
• Sensors
• IMEMS
• MOEMS
• Lab-on-Chips
• BioChips
• Microarrays

Composites
• Fiberglass
• Polymers
• Graphite
• Metal Matrix
• Hybrid
• Other

Materials
• Glass
• Ceramics
• Plastics
• Adhesives
• Metals
• X-ray Targets

Solar Energy
• Thin Film
• Polymer-Based
• Silicon

Packaging, Seals
• Food
• Medical
• Pharma
• Other Hermetic

Medical
• Materials
• Devices

View a complete list of technical application notes showing examples of various defects, as well as optimal analysis techniques.

AMI Overview

Application Notes

Technical Updates

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