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Home > Market Applications > MEMS

Microelectromechanical Systems (MEMS)

Delaminations and voids can compromise the hermiticity of MEMS devices. Sonoscan's C-SAMŽ acoustic microscope technology delivers the next generation of innovation for MEMS inspection, finding the defects that hermetic testing just can't detect.

Bonded Wafers
     • SEMI MS5
Fabrication Process Evaluation
Zero Level Packaging
Seal Integrity Evaluation
     • SEMI MS8
Packaging
Sensors
IMEMS
MOEMS
Lab-on-Chips
BioChips
Microarrays


Bonded Wafer
Optical and acoustic images showing voids
Bonded Wafer Voids
 AMI Overview

Application Notes

Technical Updates

Free Sample Analysis