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Hidden defects such as delaminations, cracks and voids within a microelectronic application can lead to catastrophic failure of the device. Sonoscan's Acoustic Micro Imaging has always been the most trusted technology for nondestructive inspection of microelectronics.
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Plastic Encapsulated Microcircuits
• PBGAs
• PLCCs, PQFPs, TSOPs, SOICs, TQFPs
• J-STD-020, J-STD-035
• NASA: PEM-INST-001
• ESA/SCC Spec No.25200
Ceramic Chip Capacitors
• Discoidals, Filters, MLCCs, etc.
• Mil-PRF-123, 31033 & 49470
Die Attach
• Mil-STD-883–Method 2030
Chip Scale Package (CSPs)
Flip Chips
Stacked Dies
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Ball Grid Arrays (BGAs, CBGAs)
Tape Automated Bond (TAB)
• Mil-STD-883–Method 2035
Hybrids, MCMs, SIPs
Flex Circuits
Printed Circuit Boards (PCB)
Smart Cards
Bonded Wafers
• Direct, Anodic, Glass Frit, Intermediate layer
• SEMI MS5
Thermo Electric Coolers (TECs)
Power Modules
Sensors
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PQFP
Optical and acoustic images showing popcorn crack defect |
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PQFP
Optical and acoustic images showing die
attach defects |
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TSOP
Optical and acoustic images showing defects |
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PDIP Group
Optical and acoustic images showing defects |
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TQFP
Optical and acoustic images showing defects |
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TQFP Group
Optical and acoustic images showing defects in a JEDEC tray scan |
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PGA
Optical and acoustic images showing defects |
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Ceramic Chip Capacitor
Optical and acoustic images showing defects |
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Chip on Board (COB)
Optical and acoustic images showing die
attach defects |
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Smart Card
Optical and acoustic images showing die
crack defects |
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Smart Card
Optical and acoustic images showing demaminations |
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Flip Chip
Optical and acoustic images showing
underfill voids |
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Hybrid
Optical and acoustic images showing
underfill voids |
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Flex Circuit (BGA)
Optical and acoustic images showing
delaminations |
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PCB
Optical and acoustic images showing
defects on circuit board |
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Bonded Wafer
Optical and acoustic images showing voids |
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Ball Grid Array
Optical and acoustic images showing voids in the die attach |
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Stacked Die
Optical and acoustic images showing cracks |
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Thermo Electric Cooler
Optical and acoustic images showing voids |
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Power Module
Optical and acoustic images showing voids and delaminations |
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Metal PCB
Optical and acoustic images showing defects |
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