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Home > Market Applications > Microelectronics

Microelectronics

Hidden defects such as delaminations, cracks and voids within a microelectronic application can lead to catastrophic failure of the device. Sonoscan's Acoustic Micro Imaging has always been the most trusted technology for nondestructive inspection of microelectronics.
Plastic Encapsulated Microcircuits
     • PBGAs
     • PLCCs, PQFPs, TSOPs, SOICs, TQFPs
     • J-STD-020, J-STD-035
     • NASA: PEM-INST-001
     • ESA/SCC Spec No.25200
Ceramic Chip Capacitors
     • Discoidals, Filters, MLCCs, etc.
     • Mil-PRF-123, 31033 & 49470
Die Attach
     • Mil-STD-883–Method 2030
Chip Scale Package (CSPs)
Flip Chips
Stacked Dies
Ball Grid Arrays (BGAs, CBGAs)
Tape Automated Bond (TAB)
     • Mil-STD-883–Method 2035
Hybrids, MCMs, SIPs
Flex Circuits
Printed Circuit Boards (PCB)
Smart Cards
Bonded Wafers
     • Direct, Anodic, Glass Frit, Intermediate layer
     • SEMI MS5
Thermo Electric Coolers (TECs)
Power Modules
Sensors

PQFP  
Optical and acoustic images showing popcorn crack defect
Plastic Encapsulated Microcircuit Popcorn Crack Defect

PQFP  
Optical and acoustic images showing die
attach defects
Plastic Encapsulated Microcircuit Die Attach Defects

TSOP  
Optical and acoustic images showing defects
Plastic Encapsulated Microcircuit Defects

PDIP Group  
Optical and acoustic images showing defects
PDIP Group Defects

TQFP  
Optical and acoustic images showing defects
Plastic Encapsulated Microcircuit Defects

TQFP Group  
Optical and acoustic images showing defects in a JEDEC tray scan
TQFP Grou Defects in JEDEC Tray Scan

PGA  
Optical and acoustic images showing defects
PGA Defects

Ceramic Chip Capacitor
Optical and acoustic images showing defects
Ceramic Chip Capacitor Defects

Chip on Board (COB)  
Optical and acoustic images showing die
attach defects
Chip on Board Die Attach Defects

Smart Card  
Optical and acoustic images showing die
crack defects
Smart Card Die Crack Defects

Smart Card  
Optical and acoustic images showing demaminations
Smart Card Delaminations

Flip Chip  
Optical and acoustic images showing
underfill voids
Flip Chip Underfill Voids

Hybrid
Optical and acoustic images showing
underfill voids
Hybrid Underfill Voids

Flex Circuit (BGA)
Optical and acoustic images showing
delaminations
Flex Circuit Delaminations

PCB
Optical and acoustic images showing
defects on circuit board
Circuit Board Defects

Bonded Wafer
Optical and acoustic images showing voids
Bonded Wafer Voids

Ball Grid Array
Optical and acoustic images showing voids in the die attach
Ball Grid Array Voids in Die Attach

Stacked Die
Optical and acoustic images showing cracks
Stacked Die Cracks

Thermo Electric Cooler
Optical and acoustic images showing voids
Thermo Electric Cooler Voids

Power Module
Optical and acoustic images showing voids and delaminations
Power Module Voids and Delaminations

Metal PCB  
Optical and acoustic images showing defects
Metal Circuit Board Defects
Special Values

Application Notes

Technical Updates

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