SonoLab applications personnel each have an average of more than ten years of experience in various industries, including microelectronics, materials, medical devices, pharmaceutical packaging and food packaging.

SonoLab’s integration of leading edge Sonoscan equipment with unmatched applications expertise has made SonoLab the recognized industry standard for nondestructive Acoustic Micro Imaging inspection services.

Microelectronics

Plastic Encapsulated IC
     • PLCC, PQFP, TSOP, SOIC, TQFP
     • BGA, PBGA, CBGA
     • J-STD-020, J-STD-035
     • NASA: PEM-INST-001
Ceramic Chip Capacitor
     • Discoidal, Filter, MLCC, etc.
     • Mil-PRF-123, 31033 & 49470
Die Attach, Chip-on-Board (COB)
     • Mil-STD-883–Method 2030
Chip Scale Package (CSP)
Stacked Die
Tape Automated Bond (TAB)
     • Mil-STD-883–Method 2035
Hybrid, MCM, SIP
Flex Circuit
Printed Circuit Board (PCB)
Smart Card
Bonded Wafers
     • Direct, Anodic, Glass Frit, Intermediate layer
     • J-STD-039
IMEMS


Micro Electromechanical Systems (MEMS)

Bonded Wafers
Fabrication Process Evaluation
Packaging
     • Zero Level
     • Encapsulation


Mil/Aero/Auto

High-Rel Qualification
Upscreening COTS
Qualification
     • J-STD-020 (Moisture/Reflow Classification)
     • Mil-STD-883–Methods 2030 (Die Attach) & 2035 (TAB)
     • Mil-PRF-123, 31033 & 49470 (Capacitors)
     • NASA: PEM-INST-001


Materials

Ceramic, Glass
Metal, Powdered Metal
Plastic
Composite


Composites

Fiberglass
Polymers
Graphite
Metal Matrix
Hybrid
Other


Solar Energy

Thin Film
     • Amorphous Silicon (a-Si)
     • Cadmium Telluride (CdTe)
     • Gallium Selenide (CIGS)
Polymer-Based
Graphite
Silicon
     • Crystalline Silicon (c-Si) (Mono & Poly)
     • Amorphous Silicon (a-Si)


Packaging, Seals (Poly/Foil)

Food
Medical
Pharma
Other Hermetic


Medical

Material
     • Replacement Joints
     • Implants
Devices
     • Filter Cartridges
     • Lab-on-Chips
     • BioChips
     • MicroFluidics
     • Microarrays