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Home > Resources > Acoustic Microscopy Application Notes
Acoustic Microscopy Application Notes
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Plastic ICs/PEMs
2535  PBGA Substrate Delaminations
2566  TQFP Die Surface Delaminations

Flex Circuit

Smart Card

Bonded Wafers

Chip Scale Package

Flip Chip

Hybrid

Ceramic

Solar Cells

Packaging, Seals

Materials

Other
   
Free Sample Analysis

Applications