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Publications & Whitepapers

Microelectronics - Bonded Wafer
Microelectronics - Chip Capacitor
Microelectronics - Chip Scale Package
Microelectronics - Flip Chip
Microelectronics - Hybrid/MCM/SIP
Microelectronics - IGBT Power Modules
Microelectronics - Plastic IC Packaging/PEM
Microelectronics - Plastic IC Packaging/PEM/BGA
Microelectronics - Printed Circuit Board
Microelectronics - Smart Card
Microelectronics - Stacked Die
Materials - Composite
Materials - Counterfeit Detection


Microelectronics - Bonded Wafer
Bonded Wafer Yield Increased by Acoustic Imaging (PDF)
As Presented in Wafer and Device Packaging-10
Imaging Bonded Wafer Defects for 3D (PDF)
As Presented in Semiconductor International-09
High-Frequency Acoustic Microscopy Studies of Buried Interfaces in Silicon (PDF)
As Presented at ECTC-06
Acoustic Micro Imaging in the Fourier Domain for Evaluation of Advanced Packaging (PDF)
As Presented at Pan Pac January-02
Development of a Resolution Test Wafer for Use in Acoustic Microscopy of Microelectronic Devices (PDF)
As Presented at Pan Pac January-04
Early Boost to Yields (PDF)
As Published in European Semiconductor September-01
Checking for Wafer-to-Wafer Bonding Integrity (PDF)
As Published in Electronics Engineer December-99
Evaluation of Silicon on Insulator (SOI) Bonded Wafers Using Automated Acoustic Micro Imaging (PDF)
As Presented at Pan Pac January-01
Management of Voids in Processing of Bonded Wafers (PDF)
As Published in Sonoscan White Paper October-02
Checking for Wafer-to-Wafer Bonding Integrity (PDF)
As Published in Electronics Engineer December-99
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Microelectronics - Chip Capacitor
Acoustic Micro Imaging of MLC and Polymer Capacitors (PDF)
As Published in SMT Magazine June-13
Acoustic Inspection of Square-Section Capacitors (PDF)
As Published in Passive Component January/February-07
Achieving Long-Term Reliability in Chip Capacitors (PDF)
As Published in Evaluation Engineer November-01
Acoustic Imaging of Capacitor Cracks Caused at Singulation (Korean Language) (PDF)
As Presented at SMT Korea November-06

Acoustic Imaging and Screening of Ceramic Chip Capacitors (PDF)
As Presented at Passive Component Industry August-02

Shadows Indicate Cracks (PDF)
As Published in EPP Europe May/June-07

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Microelectronics - Chip Scale Package
Chip-Scale Packages: Inspection Methods for Diverse Designs (PDF)
As Published in Electronics Engineer Nov-97
CSP and Micro-BGA Process and Damage Assessment with Acoustic Micro Imaging (PDF)
As Presented at SMTA September-00
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Microelectronics - Flip Chip
Nondestructive Method of TIM Bondline Measurement in Flip Chip Package (PDF)
As Published by H.C. Heng, V.S. Ben, K.H. Keok and J. Riemer
Inverted Acoustic Systems Cut IBGT Failures (PDF)
As Published in Power Electronics Sept-11
Flip Chip Failure Mechanisms Detected with AMI (PDF)
As Presented at Pan Pac-10
Optimizing Processes and Materials for Flip Chip Reliability (PDF)
As Published in Circuits Assembly February-04
Evaluation Of Underfill In Flip Chip And BGA On PC Boards Using 3v Reconstruction, Through Transmission Imaging (PDF)
As Presented at Pan Pac January-00
Characterization of Flip Chip Bump Failure Modes Using High Frequency Acoustic Micro Imaging (PDF)
As Presented at Interconnection June-97
Characterization of Flip Chip Interconnect Failure Modes Using High Frequency AMI with Correlative Analysis (PDF)
As Presented at IRPS April-97
Diagnosing and Avoiding Flip Chip Packaging Defects (PDF)
As Published in Evaluation Engineer November-01
Flip Chips and AMI: An Overview of Past Applications, Present Status, and Roadmap for the Future (PDF)
As Presented at ESREF October-00
High Frequency AMI for Process Monitoring and Quality Control in Flip Chip Underfill Assembly (PDF)
As Presented at APEX March-00
Flip Chips and AMI: An Overview of Past Applications, Present Status, And Roadmap for the Future (PDF)
As Presented at IAMIS March-00
Evaluation of Chip Scale Packaging Using AMI: An Overview of Applications, Limitations and Directions for Future Developments (PDF)
As Presented at Pan Pac January-98
Flip Chips and AMI: An Overview of Past Applications, Present Status, And Roadmap for the Future (PDF)
As Presented at SMTA September-00
Cleaning Up the Flip-Chip Production Act (PDF)
As Published in Printed Circuit Fabrication May-01
Cleaning Up the Flip-Chip Production Act (PDF)
As Published in Printed Circuit Fabrication January-01
Preventing Flip-Chip Solder Joint Failures (PDF)
As Published in High-Density Interconnect June-01
Flip Chip Solder Joint Failures (PDF)
As Published in High-Density Interconnect January-01
Preventing Flip-Chip Solder Joint Failures (PDF)
As Published in High-Density Interconnect August-01
In Situ Elastic Property Characterization of Flip-Chip Underfills (PDF)
As Presented at IEPS May-98
Exploring the Flip Chip to Achieve High Reliability (PDF)
As Published in Medical Electronics Manufacturing October-00
Metrology of Thin Layers in IC Packages Using an Acoustic Microprobe: Bondline Thickness (PDF)
As Presented at ECTC June-99
Acoustic Micro Imaging in the Fourier Domain for Evaluation of Advanced Packaging (PDF)
As Presented at PanPac January-02
Application Of Highly Focused, High Frequency Transducers for Evaluation of Near-Surface Flaws and Thin Packages: Smart Cards, Flip Chip, Flex Circuits and Thick Films (PDF)
As Presented at Pan Pac January-99
Evaluation of Lead-Free Solder Bonds and Effects of the Lead-Free Process on Devices Using AMI (PDF)
As Presented at SMTAI September-03

Analysis of a Previously Shipped Part - The Virtual Sample (PDF)
Sonoscan White Paper February-02

Nondestructive Bondline Measurement in Advanced Flip Chips (PDF)
As published on www.ap.pennnet.com, Advanced Packaging Industry News January-08

Method for Automated Nondestructive Analysis of Flip Chip Underfill (PDF)
As distributed at the International Conference on Soldering and Reliability May-08

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Microelectronics - Hybrid/MCM/SIP
Advancements in High Frequency, High Resolution Acoustic Micro Imaging for Thin Silicon Applications (PDF)
As Presented at Pan Pac January-11
Acoustic Microscopy Analysis of Die Attached for Satellite Applications (PDF)
As Presented at ASNT June-97
Acoustic Evaluation of Heat Sink Attachment (PDF)
As Published in Power Systems Design Europe February-04
Application of Highly Focused, High Frequency Transducers for Evaluation of Near-Surface Flaws and Thin Packages: Smart Cards, Flip Chip, Flex Circuits and Thick Films (PDF)
As Presented at Pan Pac January-99
Using Acoustic Micro Imaging to Inspect MCMS (PDF)
As Published in Electronics Engineer April-96
Quality Assurance for Multichip Modules with AMI Techniques (PDF)
As Presented at Euro ISHM October-98
Capabilities of Acoustic Micro Imaging (AMI) For Opto-Electronic Packaging (PDF)
As Presented at Opto October-03

Evaluation of Lead-Free Solder Bonds and Effects of the Lead-Free Process on Devices Using AMI (PDF)
As Presented at SMTAI September-03

Nondestructive Bondline Measurement in Advanced Flip Chips (PDF)
As published on www.ap.pennnet.com, Advanced Packaging Industry News January-08

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Microelectronics - IGBT Power Modules
IGBT Modules Benefit from Inverted Acoustic Inspection (PDF)
As Published in Bodo's Power Systems Dec-13
Surface Flatness and Bond Thickness Measurement Methods Using the Acoustic Microscope (PDF)
As Presented at SMTAI Sept-12
Acoustic Determination of IGBT Module Solder Thickness (PDF)
As Published in Bodo's Power Systems May-12
Inspecting IGBT Modules - Ultrasound or X-Ray (PDF)
As Published in Bodo's Power Systems Oct-11
Acoustic Flatness Measurement Enhances Die Attach Analysis of Power Devices (PDF)
As Published in Bodo's Power Systems Feb-10
Power Module Reliability (PDF)
As Published in Bodo's Power Systems Dec-09
Thermal Impedance Monitoring during Power Cycle Tests (PDF)
As Presented at PCIM-11
Acoustic Imaging for IGBT Reliability (PDF)
As Published in Bodo's Power Systems Dec-10

IGBT Modules for Electric Hybrid Vehicles (PDF)
As Published in Fuji Electric Review Vol. 53, No. 3

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Microelectronics - Plastic IC Packaging/PEM
Looking Acoustically at MLCCs (PDF)
As Published in Ceramics Industry Sept-10
Preventing MLCC Failures (PDF)
As Published in Circuit Assembly Aug-09
Identifying IC Package Anomalies with Acoustic Solids (PDF)
As Published in Electronics Engineer January-99
Removing Hidden Internal Packaging Defects from Production (PDF)
As Published in US Tech Nov/Dec-99
The Moisture Sensitivity Standard Goes Pb-Free (PDF)
As Published in Circuits Assembly January-07
Nondestructive Elastic Property Characterization of IC Encapsulants (PDF)
As Presented at ASME IMECE November-97
Acoustic Micro Imaging Finds Hidden Defects (PDF)
As Published in US Tech January-01
Systems Designers Should Take Care when Specifying Plastic Parts in Military Electronics. (PDF)
As Published in Military Aerospace August-00
Towards a Nondestructive Procedure for Characterization of Molding Compounds (PDF)
As Presented at IRPS October-97
Evaluation of Thin Plastic Packages Using Acoustic Micro Imaging (PDF)
As Presented at Semi Test August-96
Reclamation Keeps the Wheel Turning (PDF)
As Presented at EPP Europe February-04
Case Studies In the Evaluation of Moisture Sensitive Level (MSL) and Reliability of Devices for High Reliability Applications (PDF)
As Presented at SMTAI September-03
Evaluation of Lead-Free Solder Bonds and Effects of the Lead-Free Process on Devices Using AMI (PDF)
As Presented at SMTAI September-03
Evaluation of Pb-Free TSOP Devices (Korean Language) (PDF)
As Presented at SMT Korea October-04

Evaluation of Stacked Die Packages Using Acoustic Micro Imaging (PDF)
As Presented at Pan Pac February-05

Evaluation of Stacked Die Packages Using Acoustic Micro Imaging (PDF)
As Presented at Pan Pac January-05

Acoustic Detection of Package Contamination (PDF)
As Published in Semiconductor International April-07

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Microelectronics - Plastic IC Packaging/PEM/BGA
Acoustic Inspection of Mil/Aero Molded Underfill Flip Chips (PDF)
As Published in SMT Magazine April-12
First 2.5D Acoustic Imaging (PDF)
As Published in Solid State Tech May-13
Ultrathin, Stackable QFN Packages (PDF)
As Published in Packaging Article Tools Dec-09
Avoiding Mismatch in PoP Assembly - New acoustic method examines warped BGAs (PDF)
As Published in EPP Europe Sept-09
Finding Singulation Caused Crack in MLCC (PDF)
As Published in US Tech Online March-08
Identifying IC Package Anomalies with Acoustic Solids (PDF)
As Published in Electronics Engineer January-99
Analysis of BGA and Other Area Array Packaging Using Acoustic Micro Imaging (PDF)
As Presented at Pan Pac January-96
Evaluation of Underfill In Flip Chip and BGA On PC Boards Using 3v Reconstruction And Through Transmission
Imaging (PDF)

As Presented at Pan Pac January-00
Acoustic Micro Imaging in the Fourier Domain for Evaluation of Advanced Packaging (PDF)
As Presented at Pan Pac January-02
Swift Acoustic Inspection Rescues BGAs (PDF)
As Presented at EP&P October-02
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Microelectronics - Printed Circuit Board
Process Control Inspection of Surface Mounted Components Using Acoustic Mirco Imaging (PDF)
As Presented at SMTA Int'l-11
Evaluation of Underfill in Flip Chip and BGA on PC Boards Using 3v Reconstruction and Through Transmission
Imaging (PDF)

As Presented at Pan Pac January-00
Acoustic Tools and Applications for PCB Inspection (PDF)
As Published in EP&P November-01
Acoustic Micro Imaging Finds Hidden Defects (PDF)
As Published in US Tech January-01
Case Studies in the Evaluation of Moisture Sensitive Level (MSL) and Reliability of Devices for High Reliability (High-Rel) Applications (PDF)
As Presented at SMTAI September-03
An Overview of Solder Bond Evaluation in Electronics Applications Using Acoustic Micro Imaging (PDF)
As Presented at Afeit-Brasage September-01
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Microelectronics - Smart Card

Acoustic Imaging of Embedded ICS (PDF)
As Published in SMT January-07

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Microelectronics - Stacked Die

SonoSim Takes Mystery Out of Stacked Die (PDF)
As Published in MEPTEC Winter Edition-12

Acoustic Micro Imaging of a Stacked Die (PDF)
As Published in Semiconductor Int’l June-05

Evaluation of Stacked Die Packages Using Acoustic Micro Imaging (PDF)
As Presented at Pan Pac January-05

Update on the Evaluation of Stacked Die Packages Using Acoustic Micro Imaging (PDF)
As Presented at Pan Pac January-08

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Materials - Composite

Using Ultrasound Technology to Improve Device Reliability (PDF)
As Published in EMDT Sept-10

Acoustic Verification of Composites (PDF)
As Published in AMP March-07
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Materials - Counterfeit Detection

Acoustic Screening to Remove Suspect Plastic Components (PDF)
As Published in Circuits Assembly Nov-11

Counterfeit Components and Detection Technology (PDF)
As Published in Engineer's Guide to Military and Aerospace Technologies Sept-11

Dodging Counterfeit Electronic Components is Far More Difficult Than in the Past (PDF)
As Published in Medical Electronics Design April-11

Identifying Counterfeit Parts (PDF)
As Published in Circuits Assembly June-10

Finding Counterfeit with Ultrasound (PDF)
As Published in US Tech May-10

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