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Upcoming Free Seminars
(Click on the Registration link to the right) 

Choose one of the three sessions offered:

November 5 (9-11:30 and 1:30 - 4) OR November 6 (9-11:30 only)

IBM Hudson Valley Reserach Park
2070 Rte. 52, Hopewell Junction, NY 12533

For More Information Contact:
Michelle Forbes (847) 437-6400 ext. 276
Email us your inquiry


Free Seminars
Microscopic voids, cracks and delaminations can escape conventional electrical testing, lying in wait to cause your component to fail. Attend one of our free seminars to get acquainted with how C-SAM® (C-Mode Scanning Acoustic Microscopes) can provide answers to some of the most complex component reliability questions. You’ll be introduced to C-SAM, the principles of ultrasound, and various applications and case studies. You will learn how you can inspect and upscreen parts to industry standards, differentiate between bond and disbond at interfaces within a variety of materials, and identify defects that can’t be visualized by any other technique, including X-ray.

Would you like to see how C-SAM works on your particular parts? Just bring along a component, and our experienced SonoLab™ acoustic professionals will perform a component analysis free of charge.


Program Overview
Introduction to Acoustic Micro Imaging
Defect Detection & Applications Overview
Hands-On Equipment Demonstration
Attendee Component Analyses


Materials Applications
Bond, weld & joint characterization
Impact damage & fatigue assessment
Isolate material property variations
Measure material density, porosity, inclusions,
discontinuities, etc.
Assess interface adhesion
 
 
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