Upcoming Seminars
(Click on the location to register) 

For your convenience,
seminars are offered two times per day:

Morning seminars: 9:00am – 11:30am
Afternoon seminars: 1:30pm – 4:00pm

Sonoscan Silicon Valley
May 26, 2010
Morning and Afternoon Seminars Available
5452 Betsy Ross Drive
Santa Clara, CA 95054

Sonoscan Corporate Headquarters
June 2, 2010
Morning and Afternoon Seminars Available
2149 E. Pratt Blvd.
Elk Grove Village, IL 60007

Hilton Garden Inn, Dallas/Addison, TX
June 8, 2010
Morning and Afternoon Seminars Available
4090 Belt Line Road
Addison, TX 75001

Hilton Garden Inn, Houston/The Woodlands, TX
June 10, 2010
Morning and Afternoon Seminars Available
9301 Six Pines Drive
Houston, TX 77380

Marriott Glenpointe, Teaneck, NJ
June 15, 2010
Morning and Afternoon Seminars Available
100 Frank W Burr Blvd.
Teaneck, NJ 07666

College of Nanoscale Science/Engineering, Albany, NY
June 17, 2010
Morning and Afternoon Seminars Available
257 Fuller Road
Albany, NY 12203


For More Information Contact:
Janet Lykowski (847) 437-6400 ext. 200
Email us your inquiry

Microscopic voids, cracks and delaminations can escape conventional electrical testing, lying in wait to cause your component to fail. Attend one of our free seminars to get acquainted with how C-SAM® (C-Mode Scanning Acoustic Microscopes) can provide answers to some of the most complex component reliability questions. You’ll be introduced to C-SAM, the principles of ultrasound, and various applications and case studies. You will learn how you can inspect and upscreen parts to industry standards, differentiate between bond and disbond at interfaces within a variety of materials, and identify defects that can’t be visualized by any other technique, including X-ray.

Would you like to see how C-SAM works on your particular parts? Just bring along a component, and our experienced SonoLab™ acoustic professionals will perform a component analysis free of charge.

Program Overview
• Introduction to Acoustic Micro Imaging
• Defect Detection & Applications Overview
• Hands-On Equipment Demonstration
• Attendee Component Analyses

Materials Applications
• Bond, weld & joint characterization
• Impact damage & fatigue assessment
• Isolate material property variations
• Measure material density, porosity, inclusions,
• discontinuities, etc.
• Assess interface adhesion